Wafer line component developed for creaming, folding, conditioning and smooth cutting of wafer sheets into desired sizes.
Technical Specifications
Wafer line component developed for creaming, folding, conditioning and smooth cutting of wafer sheets into desired sizes.
This machine is designed to operate 100% synchronously with biscuit, cake, chocolate and wafer production lines in food manufacturing facilities.
After safe transportation to your factory, on-site assembly and trial production are carried out by our expert team.
Uninterrupted on-site technical support is provided for mechanical and automation parts for 1 year.
You can visit our Karaman OIZ facility or get technical information.
0551 384 41 10Cream Wafer Cutting and Block Preparation Machine (CODE: OZAY-PRD-0004) offer form for.
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